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@ThingsExpo Authors: Liz McMillan, Kevin Benedict, Elizabeth White, Pat Romanski, Kevin Jackson

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3D IC Expands in New Dimensions at Si2

The Silicon Integration Initiative (Si2), a leading global semiconductor standards consortium, announced today that Herb Reiter is joining the team of professionals in the role of Director, 3D IC Programs. Herb will leverage his breadth of knowledge and extensive network in 2.5D and 3D IC design and fabrication to enhance the business goals of Si2’s members in the Open3D Technical Advisory Board.

Herb’s background is particularly well suited for his new leadership role. After more than 20 years in technical and business roles at semiconductor and EDA companies, Herb founded eda2asic Consulting, Inc. to focus on increasing the cooperation between EDA suppliers and semiconductor vendors. In this role he introduced innovative IC design tools to the major semiconductor vendors worldwide. Herb was previously chair of the Global Semiconductor Alliance’s 3D-IC Working Group, and a 3D IC business development consultant to SEMATECH. As such, his expertise includes 3D-IC design, packaging technology, semiconductor materials as well as manufacturing and test equipment. Herb earned an MBA at San Jose State University, and Master Degrees in Business and Electrical Engineering at the University and the Technical College in Linz/Austria, respectively.

“The semiconductor industry is at a cross-road,” states Herb. “Moore’s Law process scaling is approaching practical limits. The effort and expenditure to push to the next smaller transistor size is becoming an impediment to continued progress, for all except the highest volume designs. 2.5D and 3D integrated circuits provide a fresh approach toward continued improvement of system performance, yet a key issue is ensuring sufficient interoperability and sharing of design data across various stages in the co-design process to guarantee efficient, lower cost designs. ‘Just-right’ standards, with forward-looking member companies leading the collaboration, play a critical role. That’s what is happening at Si2.”

John Ellis, Executive Vice President of Engineering, affirmed, “Herb understands the urgency in developing 3D IC standards that remove barriers in developing interoperable design tools. At Si2, we believe that the Internet of Things will be enabled by standards and organizations that take a holistic view of the semiconductor design ecosystem, as mechanical, thermal, and power considerations, for the entire package, all impact system performance. Members of our Open3D Technical Advisory Board have been visionary in their development of new standards to tackle these challenges. With Herb’s support, this team can make even faster progress toward developing the standards and business interactions needed to help enable the efficient, cohesive design environment needed for tomorrow’s products.”

Membership in Si2 projects is open to all interested parties across the semiconductor supply chain. For more information see: http://www.si2.org/?page=1137

About Si2

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards and shared R&D collaboration to improve the way integrated circuits are designed and manufactured. Now in its 26th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org.

About the Open3D TAB

The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows and co-design Member companies are: Altera (NASDAQ: ALTR), AMD (NYSE: AMD), ANSYS (NASDAQ:ANSS), Atrenta, Cadence Design Systems (NASDAQ: CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, Helic S.A., IBM (NYSE: IBM), Intel (NASDAQ: INTC), Invarian, Mentor Graphics (NASDAQ: MENT ), Qualcomm (NASDAQ: QCOM), R3Logic, SEMATECH, STMicroelectronics (NYSE: STM), and Texas Instruments (NYSE: TXN).

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