Welcome!

@ThingsExpo Authors: Pat Romanski, Liz McMillan, Zakia Bouachraoui, Yeshim Deniz, William Schmarzo

News Feed Item

3D IC Expands in New Dimensions at Si2

The Silicon Integration Initiative (Si2), a leading global semiconductor standards consortium, announced today that Herb Reiter is joining the team of professionals in the role of Director, 3D IC Programs. Herb will leverage his breadth of knowledge and extensive network in 2.5D and 3D IC design and fabrication to enhance the business goals of Si2’s members in the Open3D Technical Advisory Board.

Herb’s background is particularly well suited for his new leadership role. After more than 20 years in technical and business roles at semiconductor and EDA companies, Herb founded eda2asic Consulting, Inc. to focus on increasing the cooperation between EDA suppliers and semiconductor vendors. In this role he introduced innovative IC design tools to the major semiconductor vendors worldwide. Herb was previously chair of the Global Semiconductor Alliance’s 3D-IC Working Group, and a 3D IC business development consultant to SEMATECH. As such, his expertise includes 3D-IC design, packaging technology, semiconductor materials as well as manufacturing and test equipment. Herb earned an MBA at San Jose State University, and Master Degrees in Business and Electrical Engineering at the University and the Technical College in Linz/Austria, respectively.

“The semiconductor industry is at a cross-road,” states Herb. “Moore’s Law process scaling is approaching practical limits. The effort and expenditure to push to the next smaller transistor size is becoming an impediment to continued progress, for all except the highest volume designs. 2.5D and 3D integrated circuits provide a fresh approach toward continued improvement of system performance, yet a key issue is ensuring sufficient interoperability and sharing of design data across various stages in the co-design process to guarantee efficient, lower cost designs. ‘Just-right’ standards, with forward-looking member companies leading the collaboration, play a critical role. That’s what is happening at Si2.”

John Ellis, Executive Vice President of Engineering, affirmed, “Herb understands the urgency in developing 3D IC standards that remove barriers in developing interoperable design tools. At Si2, we believe that the Internet of Things will be enabled by standards and organizations that take a holistic view of the semiconductor design ecosystem, as mechanical, thermal, and power considerations, for the entire package, all impact system performance. Members of our Open3D Technical Advisory Board have been visionary in their development of new standards to tackle these challenges. With Herb’s support, this team can make even faster progress toward developing the standards and business interactions needed to help enable the efficient, cohesive design environment needed for tomorrow’s products.”

Membership in Si2 projects is open to all interested parties across the semiconductor supply chain. For more information see: http://www.si2.org/?page=1137

About Si2

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards and shared R&D collaboration to improve the way integrated circuits are designed and manufactured. Now in its 26th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org.

About the Open3D TAB

The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows and co-design Member companies are: Altera (NASDAQ: ALTR), AMD (NYSE: AMD), ANSYS (NASDAQ:ANSS), Atrenta, Cadence Design Systems (NASDAQ: CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, Helic S.A., IBM (NYSE: IBM), Intel (NASDAQ: INTC), Invarian, Mentor Graphics (NASDAQ: MENT ), Qualcomm (NASDAQ: QCOM), R3Logic, SEMATECH, STMicroelectronics (NYSE: STM), and Texas Instruments (NYSE: TXN).

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

IoT & Smart Cities Stories
The hierarchical architecture that distributes "compute" within the network specially at the edge can enable new services by harnessing emerging technologies. But Edge-Compute comes at increased cost that needs to be managed and potentially augmented by creative architecture solutions as there will always a catching-up with the capacity demands. Processing power in smartphones has enhanced YoY and there is increasingly spare compute capacity that can be potentially pooled. Uber has successfully ...
The deluge of IoT sensor data collected from connected devices and the powerful AI required to make that data actionable are giving rise to a hybrid ecosystem in which cloud, on-prem and edge processes become interweaved. Attendees will learn how emerging composable infrastructure solutions deliver the adaptive architecture needed to manage this new data reality. Machine learning algorithms can better anticipate data storms and automate resources to support surges, including fully scalable GPU-c...
To Really Work for Enterprises, MultiCloud Adoption Requires Far Better and Inclusive Cloud Monitoring and Cost Management … But How? Overwhelmingly, even as enterprises have adopted cloud computing and are expanding to multi-cloud computing, IT leaders remain concerned about how to monitor, manage and control costs across hybrid and multi-cloud deployments. It’s clear that traditional IT monitoring and management approaches, designed after all for on-premises data centers, are falling short in ...
Predicting the future has never been more challenging - not because of the lack of data but because of the flood of ungoverned and risk laden information. Microsoft states that 2.5 exabytes of data are created every day. Expectations and reliance on data are being pushed to the limits, as demands around hybrid options continue to grow.
Dion Hinchcliffe is an internationally recognized digital expert, bestselling book author, frequent keynote speaker, analyst, futurist, and transformation expert based in Washington, DC. He is currently Chief Strategy Officer at the industry-leading digital strategy and online community solutions firm, 7Summits.
With 10 simultaneous tracks, keynotes, general sessions and targeted breakout classes, @CloudEXPO and DXWorldEXPO are two of the most important technology events of the year. Since its launch over eight years ago, @CloudEXPO and DXWorldEXPO have presented a rock star faculty as well as showcased hundreds of sponsors and exhibitors! In this blog post, we provide 7 tips on how, as part of our world-class faculty, you can deliver one of the most popular sessions at our events. But before reading...
If a machine can invent, does this mean the end of the patent system as we know it? The patent system, both in the US and Europe, allows companies to protect their inventions and helps foster innovation. However, Artificial Intelligence (AI) could be set to disrupt the patent system as we know it. This talk will examine how AI may change the patent landscape in the years to come. Furthermore, ways in which companies can best protect their AI related inventions will be examined from both a US and...
Charles Araujo is an industry analyst, internationally recognized authority on the Digital Enterprise and author of The Quantum Age of IT: Why Everything You Know About IT is About to Change. As Principal Analyst with Intellyx, he writes, speaks and advises organizations on how to navigate through this time of disruption. He is also the founder of The Institute for Digital Transformation and a sought after keynote speaker. He has been a regular contributor to both InformationWeek and CIO Insight...
DXWorldEXPO LLC, the producer of the world's most influential technology conferences and trade shows has announced the 22nd International CloudEXPO | DXWorldEXPO "Early Bird Registration" is now open. Register for Full Conference "Gold Pass" ▸ Here (Expo Hall ▸ Here)
Bill Schmarzo, Tech Chair of "Big Data | Analytics" of upcoming CloudEXPO | DXWorldEXPO New York (November 12-13, 2018, New York City) today announced the outline and schedule of the track. "The track has been designed in experience/degree order," said Schmarzo. "So, that folks who attend the entire track can leave the conference with some of the skills necessary to get their work done when they get back to their offices. It actually ties back to some work that I'm doing at the University of ...