Welcome!

@ThingsExpo Authors: Yeshim Deniz, Pat Romanski, Elizabeth White, Liz McMillan, Zakia Bouachraoui

News Feed Item

HED Launches the First 55nm Smart Card Chip Based on SMIC's 55nm LL eFlash Platform

SHANGHAI, Aug. 4, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) and CEC Huada Electronic Design Co., Ltd. ("HED") jointly announced today that HED has launched China's first 55nm smart card chip based on SMIC's 55nm LL (low leakage) eFlash (embedded flash) platform. With the benefits of being smaller in size, lower power consumption and faster performance, it has been put into mass production and is being widely recognized by customers.

SMIC's 55nm LL eFlash platform offers high-performance and low-cost solutions to customers. The platform has complete logic compatibility and all of our extensive 1.2V logic library IPs can be applied to this embedded platform. The lower logic voltage of the 1.2V core device reduces the chips' power consumption and maximizes their performance. In addition, the performance and reliability has been made more efficient with the use of Cu-BEoL (Back-end of Line). This allows a higher electric current density in the existing design by having a lower electrical resistance caused by Copper's electro-migration. The surface area of the chips has shrunk significantly and the smaller cell size allows the application of large flash memory possible. As the flash cell continues to shrink, the chip area will be further optimized to make it more economical. At present, the technology platform has passed the product reliability test and can meet the application requirements of standard smart cards. Based on this platform, HED has successfully launched China's first advanced 55nm smart card chip to market.

"HED is committed to exploring new technologies and applications, such as 55nm analog circuit design and system design technologies, and 12" wafer testing and dicing technologies. The research results have been applied to product development and allow new products to be launched into market more quickly. " said Mr. Dong Haoran, General Manager of HED, "the successful cooperation with SMIC on 55nm smart card chip further strengthens our leading position in this field in China, and also demonstrates SMIC's efforts on developing advanced technologies. We're impressed with SMIC's stable and complete technology platform and believe we can work together to offer customers products that are low-cost, power efficient, highly reliable and durable."

"SMIC focuses on providing differentiated products and high-quality services to customers and meet their needs with highly integrated advanced technology platforms and high-efficient solutions," said Dr. Tzu-Yin Chiu, chief executive officer and executive director of SMIC. "HED has been a driver in China's smart card chip technologies. We are pleased to become its partner and help launch its leading smart card chip product. With the rapid growth of China's smart card market, SMIC will continue to collaborate with HED and help customers expand the market and obtain more shares with advanced technology platforms and world class services."

About HED

CEC Huada Electronic Design Co., Ltd. (HED) is an IC design company established in June 2002, and was previously known as Huada Integrated Circuit Design Center, the first IC design sector in mainland China. In 2009, HED became a wholly owned subsidiary company of China Electronics Corporation Holdings Co. Ltd., which was listed on the Hong Kong Stock Exchange (00085.HKSE).

HED specializes in IC design, development, sales and provides solutions to customers mainly in smart cards, internet of things and satellite navigation applications. Its products are widely used in the second-generation ID card, as well as other sectors in social security, refueling, mobile communication, public utilities, transportation, anti-counterfeiting of commodity, asset management, location information services, etc.

With many years of design and application development experience, HED has become one of the most comprehensive companies in smart card chip with significant market share in various application fields. Being the leader of the industry and also one of the top 10 IC design companies in China, HED has contributed towards setting up many national and industrial standards.

About SMIC

Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services at 0.35-micron to 28-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab in Beijing and a majority owned 300mm fab for advance nodes under development; a 200mm fab in Tianjin; and a 200mm fab project under development in Shenzhen. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com.

Safe Harbor Statements

(Under the Private Securities Litigation Reform Act of 1995)

This document contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project" and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets and intensive intellectual property litigation in high tech industry.

In addition to the information contained in this document, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 14, 2014, especially in the "Risk Factors" section and such other documents that we may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this document may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this document.

SMIC Contact Information:

English Media
Michael Cheung
Tel: +86-21-3861-0000 x16812
Email: [email protected]

Chinese Media
Angela Miao
Tel: +86-21-3861-0000 x10088
Email: [email protected]

SOURCE Semiconductor Manufacturing International Corporation

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

IoT & Smart Cities Stories
When talking IoT we often focus on the devices, the sensors, the hardware itself. The new smart appliances, the new smart or self-driving cars (which are amalgamations of many ‘things'). When we are looking at the world of IoT, we should take a step back, look at the big picture. What value are these devices providing. IoT is not about the devices, its about the data consumed and generated. The devices are tools, mechanisms, conduits. This paper discusses the considerations when dealing with the...
Charles Araujo is an industry analyst, internationally recognized authority on the Digital Enterprise and author of The Quantum Age of IT: Why Everything You Know About IT is About to Change. As Principal Analyst with Intellyx, he writes, speaks and advises organizations on how to navigate through this time of disruption. He is also the founder of The Institute for Digital Transformation and a sought after keynote speaker. He has been a regular contributor to both InformationWeek and CIO Insight...
IoT is rapidly becoming mainstream as more and more investments are made into the platforms and technology. As this movement continues to expand and gain momentum it creates a massive wall of noise that can be difficult to sift through. Unfortunately, this inevitably makes IoT less approachable for people to get started with and can hamper efforts to integrate this key technology into your own portfolio. There are so many connected products already in place today with many hundreds more on the h...
CloudEXPO New York 2018, colocated with DXWorldEXPO New York 2018 will be held November 11-13, 2018, in New York City and will bring together Cloud Computing, FinTech and Blockchain, Digital Transformation, Big Data, Internet of Things, DevOps, AI, Machine Learning and WebRTC to one location.
SYS-CON Events announced today that IoT Global Network has been named “Media Sponsor” of SYS-CON's @ThingsExpo, which will take place on June 6–8, 2017, at the Javits Center in New York City, NY. The IoT Global Network is a platform where you can connect with industry experts and network across the IoT community to build the successful IoT business of the future.
Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life settlement products to hedge funds and investment banks. After, he co-founded a revenue cycle management company where he learned about Bitcoin and eventually Ethereal. Andrew's role at ConsenSys Enterprise is a mul...
DXWorldEXPO | CloudEXPO are the world's most influential, independent events where Cloud Computing was coined and where technology buyers and vendors meet to experience and discuss the big picture of Digital Transformation and all of the strategies, tactics, and tools they need to realize their goals. Sponsors of DXWorldEXPO | CloudEXPO benefit from unmatched branding, profile building and lead generation opportunities.
Disruption, Innovation, Artificial Intelligence and Machine Learning, Leadership and Management hear these words all day every day... lofty goals but how do we make it real? Add to that, that simply put, people don't like change. But what if we could implement and utilize these enterprise tools in a fast and "Non-Disruptive" way, enabling us to glean insights about our business, identify and reduce exposure, risk and liability, and secure business continuity?
The best way to leverage your Cloud Expo presence as a sponsor and exhibitor is to plan your news announcements around our events. The press covering Cloud Expo and @ThingsExpo will have access to these releases and will amplify your news announcements. More than two dozen Cloud companies either set deals at our shows or have announced their mergers and acquisitions at Cloud Expo. Product announcements during our show provide your company with the most reach through our targeted audiences.
DXWorldEXPO LLC announced today that Telecom Reseller has been named "Media Sponsor" of CloudEXPO | DXWorldEXPO 2018 New York, which will take place on November 11-13, 2018 in New York City, NY. Telecom Reseller reports on Unified Communications, UCaaS, BPaaS for enterprise and SMBs. They report extensively on both customer premises based solutions such as IP-PBX as well as cloud based and hosted platforms.