Welcome!

@ThingsExpo Authors: Elizabeth White, Pat Romanski, Liz McMillan, Anil Kaul, Titir Pal

News Feed Item

Telit Debuts Telit ATOP 3.5G at Telematics Detroit

Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules, value-added services and solutions, today introduced the new Telit ATOP 3.5G, its new flagship product resulting from the recent acquisition of the Automotive Telematics On-board unit Platform (ATOP) business from Netherlands-based NXP Semiconductors (Nasdaq NXPI).

The ATOP 3.5G simplifies the development of automotive applications such as road pricing and eCall thanks to its unique integration of all required technologies, including: 3G cellular connectivity for voice and data communication; GPS/GLONASS for location, and near-field communications for driver authentication or to facilitate mobile payments directly from the car.

In addition, the ATOP 3.5G offers unparalleled processing power, thanks to three onboard processors. An application processor runs Java J9 Virtual Machine for simple code creation and portability. A dedicated interface processor manages vehicle interface using a choice of technologies including CAN, USB, Ethernet, UART and ADC. Plus, the optional SmartMX smartcard CPU with Java card JCOP OS provides embedded, hardware-based security for rock-solid fraud prevention and data integrity, suitable for end-to-end transaction systems requiring Common Criteria level 5+.

Fully backward-compatible with the 2.5G product already on the market from NXP, the Telit ATOP 3.5G is available in three variants for global network coverage.

“The ATOP 3.5G supports an industry leading range of features from a single package,“ said Dominik Hierl, CEO of Telit Automotive Solutions. “It is a perfect complement to the rest of our ONE STOP. ONE SHOP. products and services offering, designed to make the integration of connected functionality easier than ever for Automotive OEMs to adopt and commercialize.“

The first new product from the recently formed Telit Automotive Solutions business unit, the ATOP 3.5G joins a family of products designed specifically to meet the needs of the Automotive OEM marketplace. Telit automotive products are subject to automotive-grade lifecycle and process management. They offer easy scalability thanks to family form factors; global operations, and global regulatory and carrier certification. Moreover, they represent industry-leading innovation with a roadmap to the latest, cutting-edge technologies plus intelligent integration of new hardware, software and services functionalities.

With over 12 years of unparalleled focus on M2M, reducing technical risk and shortening time to market for OEMs and integrators, Telit’s ONE STOP. ONE SHOP delivers all necessary services and products to connect assets to the Internet of Things. Whether sourcing single products or full end-to-end solutions, count on M2M’s broadest portfolio in cellular, short range and positioning technologies paired with m2mAIR services covering application enablement as well as deployment management & connectivity under mobile networks and over the internet & cloud. Telit benchmark-quality products and services are delivered with global support and logistics exceeding exacting requirements from customers large and small. Telit’s ONE STOP. ONE SHOP. delivers the Internet of Things made Plug & Play. Now innovate!

About Telit

Telit Wireless Solutions (AIM: TCM listed as Telit Communications PLC), is a global enabler of machine-to-machine (M2M) communications. Its ONE STOP. ONE SHOP. provides cellular, short-to-long range, positioning modules plus m2mAIR, PaaS managed and value added services in application enablement, connectivity under mobile networks and Cloud. Telit operates business unit Telit Automotive Solutions delivering automotive-grade products like the Automotive On-board Platform (ATOP) and services to auto manufacturers and tier-one auto suppliers; and business unit Telit GNSS Solutions reaching M2M and beyond, delivering award-winning geo-positioning products to the broader electronics and OEM markets. With over 12 years exclusively only in M2M, the company constantly advances technology through a network of R&D centers around the globe; marketing products and services in over 80 countries.

By supplying scalable products interchangeable across families, technologies and generations, rapid prototyping tools for application development, and m2m tailored connectivity, Telit is able to reduce development costs, protect design investments and minimize technical risk. The company provides customer support and design-in assistance through 35 sales and support offices, a global distributor network of experts with over 30 competence centers, and the Telit Technical Support Forum.

Telit provides products services and facilities to connect organizations to the Internet of Things (IoT) allowing them to wirelessly collect, process and respond to real-world data from connected devices, creating new efficiencies, revenue streams, societal and personal benefits. Join the conversation and learn more about Telit and its customers’ innovative applications on Facebook and Twitter.

Copyright © 2014 Telit Communication PLC. All rights reserved. Telit, Telit Wireless Solutions, Telit Communication PLC, telit.com, telit2market, Telit Technical Forum, m2mAIR, m2mAIR.com, secureWISE, deviceWISE and all associated logos are trademarks of Telit Communications PLC in the United States and other countries. Other names used herein may be trademarks of their respective owners.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

@ThingsExpo Stories
Companies can harness IoT and predictive analytics to sustain business continuity; predict and manage site performance during emergencies; minimize expensive reactive maintenance; and forecast equipment and maintenance budgets and expenditures. Providing cost-effective, uninterrupted service is challenging, particularly for organizations with geographically dispersed operations.
SYS-CON Events announced today Object Management Group® has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
SYS-CON Events announced today that Alert Logic, Inc., the leading provider of Security-as-a-Service solutions for the cloud, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Alert Logic, Inc., provides Security-as-a-Service for on-premises, cloud, and hybrid infrastructures, delivering deep security insight and continuous protection for customers at a lower cost than traditional security solutions. Ful...
SYS-CON Events announced today that MobiDev will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. MobiDev is a software company that develops and delivers turn-key mobile apps, websites, web services, and complex software systems for startups and enterprises. Since 2009 it has grown from a small group of passionate engineers and business managers to a full-scale mobile software company with over 200 develope...
SYS-CON Events announced today that EastBanc Technologies will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. EastBanc Technologies has been working at the frontier of technology since 1999. Today, the firm provides full-lifecycle software development delivering flexible technology solutions that seamlessly integrate with existing systems – whether on premise or cloud. EastBanc Technologies partners with p...
WebRTC is bringing significant change to the communications landscape that will bridge the worlds of web and telephony, making the Internet the new standard for communications. Cloud9 took the road less traveled and used WebRTC to create a downloadable enterprise-grade communications platform that is changing the communication dynamic in the financial sector. In his session at @ThingsExpo, Leo Papadopoulos, CTO of Cloud9, will discuss the importance of WebRTC and how it enables companies to fo...
SYS-CON Events announced today TechTarget has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. TechTarget is the Web’s leading destination for serious technology buyers researching and making enterprise technology decisions. Its extensive global networ...
SoftLayer operates a global cloud infrastructure platform built for Internet scale. With a global footprint of data centers and network points of presence, SoftLayer provides infrastructure as a service to leading-edge customers ranging from Web startups to global enterprises. SoftLayer's modular architecture, full-featured API, and sophisticated automation provide unparalleled performance and control. Its flexible unified platform seamlessly spans physical and virtual devices linked via a world...
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named “Bronze Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management...
SYS-CON Events announced today that BMC Software has been named "Siver Sponsor" of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2015 at the Javits Center in New York, New York. BMC is a global leader in innovative software solutions that help businesses transform into digital enterprises for the ultimate competitive advantage. BMC Digital Enterprise Management is a set of innovative IT solutions designed to make digital business fast, seamless, and optimized from mainframe to mo...
SYS-CON Events announced today that Tintri Inc., a leading producer of VM-aware storage (VAS) for virtualization and cloud environments, will exhibit at the 18th International CloudExpo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
SYS-CON Events announced today BZ Media LLC has been named “Media Sponsor” of SYS-CON's 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and Commercial Drone markets.
SYS-CON Events announced today that MangoApps will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. MangoApps provides modern company intranets and team collaboration software, allowing workers to stay connected and productive from anywhere in the world and from any device. For more information, please visit https://www.mangoapps.com/.
A strange thing is happening along the way to the Internet of Things, namely far too many devices to work with and manage. It has become clear that we'll need much higher efficiency user experiences that can allow us to more easily and scalably work with the thousands of devices that will soon be in each of our lives. Enter the conversational interface revolution, combining bots we can literally talk with, gesture to, and even direct with our thoughts, with embedded artificial intelligence, wh...
The IoT is changing the way enterprises conduct business. In his session at @ThingsExpo, Eric Hoffman, Vice President at EastBanc Technologies, discuss how businesses can gain an edge over competitors by empowering consumers to take control through IoT. We'll cite examples such as a Washington, D.C.-based sports club that leveraged IoT and the cloud to develop a comprehensive booking system. He'll also highlight how IoT can revitalize and restore outdated business models, making them profitable...
SYS-CON Events announced today that ContentMX, the marketing technology and services company with a singular mission to increase engagement and drive more conversations for enterprise, channel and SMB technology marketers, has been named “Sponsor & Exhibitor Lounge Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York. “CloudExpo is a great opportunity to start a conversation with new prospects, but what happens after the...
The essence of data analysis involves setting up data pipelines that consist of several operations that are chained together – starting from data collection, data quality checks, data integration, data analysis and data visualization (including the setting up of interaction paths in that visualization). In our opinion, the challenges stem from the technology diversity at each stage of the data pipeline as well as the lack of process around the analysis.
The 19th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Containers, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportunity. Submit y...
Internet of @ThingsExpo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 19th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world and ThingsExpo New York Call for Papers is now open.
Designing IoT applications is complex, but deploying them in a scalable fashion is even more complex. A scalable, API first IaaS cloud is a good start, but in order to understand the various components specific to deploying IoT applications, one needs to understand the architecture of these applications and figure out how to scale these components independently. In his session at @ThingsExpo, Nara Rajagopalan is CEO of Accelerite, will discuss the fundamental architecture of IoT applications, ...